柏匯 K.T /鋁基板專業/LED thermal substrate

We have strict SOP process control in every manufacturing process to ensure stable quality.

Description of Line production working description:

A.Line exposure

Line process description:
(A). Pre-treatment: Cleaning the plate surface before paste film. 1 basin of Grinding Brush, 1 basin of degreasing tank +3 basins for micro-etching treatment.
(B). Press film: The dry film attached to the panel surface, as the medium for image transference.
(C) Exposure: film contents via exposure, the image transferred to the dry film, a transparent image for not shielding film (exposed aggregate), so the dry film due to be positive. On the other hand, the black part of file become negative due to shading.

B.Line Etching:

Process Description:
1 Developing: After ripping the Mylar on the dry peel, just shading images (un-polymerized) exposed (to etching) by the photolithography process, leaving the un-shading (Exposure polymerization) to protect the content images.
2. Etching: etching the shading images (un-polymerized).
3 Off-membrane: After etching, dry film features was end, then stripping the dry membrane.

Etching machine

上圖：Before etching 下圖：After etching

3. Line Scan:

Process description: 1. A.O.I description： Customer provide Gerber File，then converting to available file, setting parameters to AOI side; compare the and catch out and display the image , in order to judgment and confirmation.

A.O.I Scan and Test machine

NG panel image display

OK Panel Line finished

Introduction for Solder and printing

A. Solder Printing

Process Description :
1 Solder Process Objective: Solder resist layer formed on the substrate, a PAD as for customer’s need and developing the hole position.
2 control key-points:
2-1 solder type and color。
2-2 solder thickness。
2-3 Exposure energy setting。
2-4 Temperature and concentration of the developing syrup。
2-5Baking time and temperature control。

Printing machine

上圖：Before solder printing 下圖：Pre-baking after printing

B. Exposure and development

Developing machine

After Printing and before Exposure

After exposure and development

Text printers Station description

Character printers Station Description:
1.Character printing station process objective: overlay character on a substrate for customer traceability.
2.Control points：
2-1 Character symbols
2-2 Character appearance
2-3 Character position
2-4 Character ink type no. and color。

Before character printing --->After character printing

Surface treatment (Tin-spray) work station description

Process Description:
1 Tin-spray process Objective: PAD in accordance with customer needs welding point on A layer of tin.
2.Control points:
2-1 Basic parameters HAL 。
2-2 Tin Spray thickness。
2-3 The copper content of Tin spray Bath。
2-4 Tin spray appearance control。

Lead-free Tin spray machine

上圖：Before Tin Spray 下圖：Before Tin Spray

CNC、Punch、V-CUT:

A .CNC+punch

Forming process purpose:
1.1 After metal substrate completed, cut the outside frame or the surrounding of the panel, then hollowing the interior of panel , the operation is high-speed rotation (side milling) method, to keep the border sheet (cut off), or (hollowing) mechanical movement
2.Panel processed into the size as for customer needs.
3.Control points:：
3-1 Processing size
3-2 First piece inspection
3-3 Paneling Appearance

CNC Forming Drills

Punch molding

上圖：Before Hole drilling & Mold punching / After hole drilling & Mold punching

B.V-CUT cutting forming

V-CUT Cutting m/c

(A) V-CUT Process objective :
Some complete small substrate to become more connected for temporary layout contiguous large plate surface by multi-pieces connecting to facilitate downstream automated assembly and welding. Such connection for the big plate surface, the positive and negative sides of connective border of each small plate, need to align the top and bottom of the V-scraper, scrape the V-shaped grooves in advance in order to facilitate subsequent break apart..

Before cutting by by V-CUT m/c ----> After cutting by by V-CUT m/c

Product testing description

Product inspecting Table

1. product testing purposes: The Finished products must be inspected according to customer requirements and our standard quality specifications. After inspection, must separate the qualified products and non-qualified products.
2. control points:
2-1 Finished product testing standards
2-2 Quality inspector competency training
2-3 Substrate status indicator

Before inspecting ----》Product after inspection

Packing and shipping :

1.The purpose of the packaging process: According to customer needs of packaging to prevent damage of substrates during the transportation.
2.Control key-points:
2-1 Mixing board packaging
2-2 Packing
2-3 Label consistent with the physical board
2-4 Bags damaged