|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| .
Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .STARΦ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
| |
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .STARΦ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .STARΦ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
CREE-MCE(All InSeries)
HI-POWER LED |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .STARΦ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:DENAK-M2 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.47 C /W (2.0 W/m.K ) |
| .Break Down Voltage:9.7kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:600
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:49PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:BERGQIST |
| .1.0㎜ Aluminum |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.45 C /W (2.2 W/m.K ) |
| .Break Down Voltage:6.0kv(素板材) |
| .Φ20 ㎜ |
SAMPLE:30PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ25.4 ㎜ |
SAMPLE:1PCS/1PNL=NTD:14 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ25.4 ㎜ |
SAMPLE:1PCS/1PNL=NTD:14 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ25.4 ㎜ |
SAMPLE:1PCS/1PNL=NTD:14 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ25.4 ㎜ |
SAMPLE:1PCS/1PNL=NTD:14 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ25.4 ㎜ |
SAMPLE:1PCS/1PNL=NTD:14 |
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
CREE- XP-3 LED
HI-POWER LED |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ32 ㎜ |
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ35 ㎜ |
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ38 ㎜ |
SAMPLE:1PCS/1PNL=NTD:24 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ44 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ44 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ45 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ45 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ45 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
 |
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ49 ㎜ |
SAMPLE:1PCS/1PNL=NTD:45 |
|
|
 |
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ58 ㎜ |
| |
SAMPLE:1PCS/1PNL=NTD:49 |
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:DENAK-M2 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.47 C /W (2.0 W/m.K ) |
| .Break Down Voltage:9.7kv(素板材) |
| Φ71 ㎜(雷笛克) |
SAMPLE:1PCS/1PNL=NTD:87.5 |
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.3C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ71 ㎜ |
SAMPLE:1PCS/1PNL=NTD:87.5 |
|
|
|
|
|
| |
|
|
|
|
|
CREE- XPE-6A-LL06ED-ADxxL |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.3C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .Φ71 ㎜ |
SAMPLE:1PCS/1PNL=NTD:87.5 |
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:DENKA-M2 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.47C /W (2.0 W/m.K ) |
| .Break Down Voltage:9.7kv(素板材) |
| .Φ105 ㎜ |
SAMPLE:1PCS/1PNL=NTD:155 |
|
|
|
|
|
| |
|
|
|
|
|
CREE- XP-12 LED
HI-POWER LED |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| Φ105 ㎜ |
SAMPLE:1PCS/1PNL=NTD:170 |
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .25*25 ㎜ |
SAMPLE:36PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
CREE- MCE
(2 In Series 2Par Allel Connection)
HI-POWER LED |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .25㎜*25㎜ |
SAMPLE:36PCS/1PNL=NTD:500
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| ..30㎜*30㎜ |
SAMPLE:80PCS/1PNL=NTD:1,280 |
|
|
 |
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .30㎜*30 ㎜ |
SAMPLE:80PCS/1PNL=NTD:1280
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.0㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (3.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .44㎜*44㎜ |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:BERGQUIST |
| .1.0㎜ Copper |
| .76μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.45 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.0kv(絕緣材) |
| .44㎜*44㎜ |
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .60*60㎜ |
SAMPLE:20PCS/1PNL=NTD:1280 |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .60*60㎜ |
SAMPLE:20PCS/1PNL=NTD:1,280
|
|
|
|
|
|
| |
|
|
|
|
|
CREE- XP-Module-100407-GB-9LED |
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .60*60㎜ |
SAMPLE:20PCS/1PNL=NTD:1,280
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .60㎜*60㎜ |
SAMPLE:20PCS/1PNL=NTD:1,280
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:Denka-M2 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.47 C /W (2.0 W/m.K ) |
| .Break Down Voltage:9.7kv(素板材) |
| .116.6㎜*96.6㎜ |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .160*60㎜ |
|
|
|
|
|
|
| |
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
. Thermal Conductivity / (Thermal Resistance):
0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .164*40.5㎜ |
SAMPLE:1PCS/1PNL=NTD:80 |
|
|
 |
|
|
|
| |
|
|
|
|
|
|
|
| |
| .Material Structure:NRA-8 |
| .1.5㎜ Aluminum |
| .80μm Material Structure Insulation |
| .1/oz(35μm)Copper Circuits |
| . Thermal Conductivity / (Thermal Resistance): 0.30 C /W (2.0 W/m.K ) |
| .Break Down Voltage:6.7kv(素板材) |
| .15㎜*300㎜ |
SAMPLE:16PCS/1PNL=NTD:1120
|
|
|
|
|
| |
| |